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US63 NXP USA Inc.

Principal Physical Design Engineer / Physical Design – ACE US

Austin (Oakhill, Office), United States of America

US63 NXP USA Inc. is hiring a Principal Physical Design Engineer / Physical Design – ACE US in Austin (Oakhill, Office), United States of America. Posted September 25, 2026.

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Job at a glance

Company
US63 NXP USA Inc.
Location
Austin (Oakhill, Office), United States of America
Workplace
On-site
Employment
Full-time
Sector
Engineering & Technology
Posted
September 25, 2026

About the job

Role Summary

We are seeking an experienced  Digital Designer for SoC Implementation / Physical Design for advanced semiconductor products. This role will own end-to-end physical design execution across complex designs, driving delivery from RTL to silicon for cutting-edge technology nodes.

The ideal candidate demonstrates  deep technical expertise to implement a given design on silicon with optimized quality and meeting PPA targets.

Key Responsibilities

1. End-to-End Physical Design Ownership

  • Lead Physical design execution including floorplanning, synthesis, place & route, CTS, routing, STA, PDN, PDV and signoff.
  • Drive timing, power, IR/EM, and physical verification closure to achieve tapeout readiness.
  • Deliver optimized PPA (Power, Performance, Area) across complex designs.
  • Aligns with internal expectations of implementing designs on silicon with optimal quality, PPA, and cost efficiency

2. Team Leadership & Organization Development

  • Participate in mentoring and career development.
  • Role-Model  execution discipline, review mechanisms, and performance tracking.
  • Interface with senior leadership for status reporting, escalation, and decision-making.

3. Technical Strategy & Innovation

  • Define and deploy next-generation physical design methodologies.
  • Drive automation, flow optimization, and tool innovation.
  • Lead adoption of advanced node technologies (5nm and beyond).
  • Improve scalability, productivity, and design quality through methodology enhancements.

4. Cross-Functional & Ecosystem Engagement

  • Collaborate with architecture, RTL, verification, and product teams to ensure design convergence.
  • Interface with EDA vendors and IP providers for tool and flow optimization.
  • Support post-silicon bring-up, yield improvement, and production ramp activities.

Core Technical Expertise

  • Full RTL-to-GDSII implementation flow (Cadence and/or Synopsys tool sets)
  • Floorplanning, synthesis, PNR, CTS, routing
  • STA and signoff methodologies
  • Physical verification (DRC/LVS/ERC)
  • Advanced node implementation (≤ 16nm / 5nm)
  • Low power design (UPF/CLP)
  • Scripting in Python, TCL, and Perl

Required Qualifications

  • Bachelor’s or Master’s in Electrical / Electronics Engineering or related field
  • 10+ years of experience in ASIC / SoC physical design
  • Strong knowledge of industry EDA tools (Synopsys, Cadence flows)
  • Strong communication skills

Preferred Qualifications

  • Experience in high-reliability SoCs
  • Exposure to AI-driven design methodologies and automation

Why This Role Matters

  • Own delivery of flagship SoCs at advanced nodes
  • Drive innovation in physical design methodologies
  • Direct impact on silicon success and product competitiveness

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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